Description

The heatsink is made of high-quality aluminum

from hard drives to keyboards to mice

Grubość tylko 330µm gwarantuje niewidoczną ochronę

dass das Gerät während des Transports versehentlich eingeschaltet wird

Micron 5400 MAX 1,92 TB 2.5" Serial ATA III 3D TLC NAND Nokia Lumia 925 The heatsink is made of1,92 TB 2. 5" Serial ATA III 94000 IOPS 63000 IOPS 3D TLC NAND Hardware kryptering 256 bit AES Komponent til: Laptop Funktioner SDD kapacitet 1,92 TB SSD formfaktor 2. 5" Grnseflade Serial ATA III Hukommelsestype 3D TLC NAND Komponent til Laptop Hardware kryptering Ja Sikkerhedsalgoritmer 256 bit AES Ml arbejdsbyrde Mixed Use (MU) Dataoverfrselshastighed 6 Gbit sek. Tilfldig lsning (4KB) 94000 IOPS Tilfldig skrivning (4KB) 63000 IOPS Ukorrigerbar

Exchange/Return Notes

We offer a 30-day return/exchange service after receiving.
Final sale items are not eligible for returns or exchanges.
To process your return/exchange, please contact us at [email protected]
Please click here for more details>>> Return & Exchange Policy

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