The XSC-600-01 desiccant dry cabinet can be used for cooking purposes with optional heating units up to 100°C

this motherboard provides the robust processing power needed for high-speed printing

2 mm with carbon fiber-reinforced filaments

making it ideal for some of the most demanding applications in any industry

Intamsys PEEK-GF Filament Diameter:1.75 mm The XSC-600-01 desiccant dry cabinetPEEK GF Fiber reinforced PEEK+GF10 PEEK has better mechanical properties and heat resistance than standard PEEK, while the glass fiber reinforcement improves crystallization speed and surface quality. Additionally, the glass fiber reinforcement provides better insulation. Reinforced with 10% chopped glass fibres Ultra high modulus and increased stiffness Fine surface quality MATERIAL CHARACTERISTICS It has strong chemical resistance, steam resistance